Opportunity: International Post-Doc Positions in Integrated Modelling of Tokamak Plasmas, Sweden

Type: Post-doctorate

Award Value: Salary

Location: Sweden

Who can Apply: Applicants from Sweden and all countries of the world are eligible to apply.

 

About the Scholarship

Get the skills and knowledge you need for the next step in your career by joining the International PostDoc Positions in Integrated Modelling of Tokamak Plasmas at the Chalmers University of Technology.

All international students and domestic students can apply for the post-doctoral position and become Assistant professors at Chalmers.

The Chalmers University of Technology is a Swedish university centered solely on research and education in technology, natural sciences, architecture, mathematics, maritime, and other management areas. Ranking 342nd in Best Global Universities, it aims to produce and spread knowledge, expertise, and solutions that benefit everyone.

 

Requirements

The students are required to present the following documents to the university:

  • CV, include a complete list of publications
  • Previous teaching and pedagogical experiences
  • Two references that we can contact.
  • Personal letter:
  • 1-3 pages where you:
  • Introduce yourself
  • Describe your previous research fields and main research results
  • Describe your future goals and future research focus
  • Attested copies of completed education, grades, and other certificates.
  • Admission Requirements: The applicants are required to provide an official transcript for all completed semesters to date.
  • Language Requirement: The applicants must have English proficiency equivalent to or above the Swedish upper secondary school English course 6. An internationally recognized English test is accepted.

 

How to Apply

The applicants are required to select a field of study and apply by clicking ‘apply’ at the bottom of that vacancy page. The application should be marked with Ref 20210289 and written in English. The application should be sent electronically and be attached as pdf-files

 

Deadline

September 1, 2021

 

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