INVESTIGATION ON HEAT DISSIPATING PROPERTIES OF ELECTRONIC COMPONENTS WITH THE AIM TO DETERMINE THE CORRECT SIZE OF HEAT SINK

Gbenga Oyede 51 PAGES (8141 WORDS) Project
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Research and optimization of cooling of electronic components using heat sinks becomes increasingly important in modern industry. Numerical methods with experimental real world verification are the main tools to evaluate efficiency of heat sinks or heat sink systems. In this research, the physical problems associated with heat removal of electronic systems at different scales were studied.

ABSTRACT

 Research and optimization of cooling of electronic components using heat sinks becomes increasingly important  in  modern industry.  Numerical  methods  with experimental  real world  verification  are  the  main  tools  to  evaluate  efficiency  of  heat  sinks  or  heat  sink systems.  In  this  research,  the  physical  problems  associated  with  heat  removal  of electronic  systems  at  different  scales  were  studied.  Various  electronic  cooling  system designs  and  specific  cooling  techniques  to  improve  performance  were  discussed. Optimization  procedures  and  suggestion  for  better  design  was  proposed.  Power dissipation  performance  must  be  well  understood  prior  to  integrating  devices  on  a circuitboard to ensure that any given device is operated within its defined temperature limits. When adevice is running, it consumes electrical energy that is transformed into heat. Most of the heat is typicallygenerated by switching devices like FETs, ICs, etc. The relationship  between  the  reliability  and  the  operating  temperature  of  a  typical  silicon semiconductor  device  shows  that  a  reduction  in  the  temperature  corresponds  to  an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the operating limits.  This report discusses the thermal  dissipation  terminology  and  how  to  design  a  proper  heat  sink  for  a  given dissipation limit.    

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TABLE OF CONTENT 

TITLE PAGE ....................................................................................................................... i CERTIFICATION .............................................................................................................. ii DEDICATION ................................................................................................................... iii ACKNOWLEDGEMENT ................................................................................................. iv ABSTRACT ........................................................................................................................ v TABLE OF CONTENTS ................................................................................................... vi 

CHAPTER ONE ................................................................................................................. 1 INTRODUCTION .......................................................................................................... 1 

1.1  Background Information to the Study .............................................................. 1 

1.2  Statement of Problem ....................................................................................... 3 

1.3  Significance of the Research ............................................................................ 5 

1.4  Objective of the Research ................................................................................. 5 

1.5  Definition of Terms .......................................................................................... 8


 CHAPTER TWO .............................................................................................................. 11 LITERATURE REVIEW ............................................................................................. 11 2.1  Background Information ................................................................................. 11 


CHAPTER THREE .......................................................................................................... 22 RESEARCH METHODOLOGY.................................................................................. 22 

 3.1  Design Analysis .............................................................................................. 22 

3.2  Selection of Materials ..................................................................................... 26 

3.3  Experimental Set Up ....................................................................................... 27 

3.4  BILL OF ENGINEERING MEASUREMENT AND EVALUATION ......... 32 


CHAPTER FOUR ............................................................................................................. 33 RESULTS AND DISCUSSION ................................................................................... 33 

4.1  PERFORMANCE TEST ................................................................................ 33 

4.2  PRESENTATION OF RESULTS .................................................................. 33 


CHAPTER FIVE .............................................................................................................. 40

CONCLUSION AND RECOMMENDATION ............................................................ 40 

5.1  Conclusion ...................................................................................................... 40 

5.2  Recommendation ............................................................................................ 40

REFERENCES ................................................................................................................. 41 

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APA

Gbenga, O (2019). INVESTIGATION ON HEAT DISSIPATING PROPERTIES OF ELECTRONIC COMPONENTS WITH THE AIM TO DETERMINE THE CORRECT SIZE OF HEAT SINK. Afribary.com: Retrieved November 12, 2019, from https://afribary.com/works/investigation-on-heat-dissipating-properties-of-electronic-components-with-the-aim-to-determine-the-correct-size-of-heat-sink

MLA 8th

Oyede, Gbenga. "INVESTIGATION ON HEAT DISSIPATING PROPERTIES OF ELECTRONIC COMPONENTS WITH THE AIM TO DETERMINE THE CORRECT SIZE OF HEAT SINK" Afribary.com. Afribary.com, 20 Aug. 2019, https://afribary.com/works/investigation-on-heat-dissipating-properties-of-electronic-components-with-the-aim-to-determine-the-correct-size-of-heat-sink . Accessed 12 Nov. 2019.

MLA7

Oyede, Gbenga. "INVESTIGATION ON HEAT DISSIPATING PROPERTIES OF ELECTRONIC COMPONENTS WITH THE AIM TO DETERMINE THE CORRECT SIZE OF HEAT SINK". Afribary.com, Afribary.com, 20 Aug. 2019. Web. 12 Nov. 2019. < https://afribary.com/works/investigation-on-heat-dissipating-properties-of-electronic-components-with-the-aim-to-determine-the-correct-size-of-heat-sink >.

Chicago

Oyede, Gbenga. "INVESTIGATION ON HEAT DISSIPATING PROPERTIES OF ELECTRONIC COMPONENTS WITH THE AIM TO DETERMINE THE CORRECT SIZE OF HEAT SINK" Afribary.com (2019). Accessed November 12, 2019. https://afribary.com/works/investigation-on-heat-dissipating-properties-of-electronic-components-with-the-aim-to-determine-the-correct-size-of-heat-sink